About Our Client

Our client is a global science and technology innovator, with a strong seasoned leadership team from established Multinationals. The organization is dedicated to advancing a sustainable future through artificial intelligence and automation.

Job Description

• Lead the conceptualization, design, and development of advanced semiconductor process equipment, optimizing performance and efficiency.
• Oversee the engineering and system architecture of modules/components to enhance instrument capabilities.
• Provide technical leadership in innovative packaging technology development, ensuring alignment with industry advancements.
• Establish and scale the R&D team regionally or globally, fostering a culture of innovation and excellence.
• Collaborate with cross-functional teams, industry partners, and stakeholders to drive product development and commercialization.

The Successful Applicant

• PhD or Master's degree in Mechanical Engineering, Electronics, Electrical Engineering, or a related field.
• Extensive experience in Hybrid Bonding or other advanced packaging processes (e.g., Flip Chip, TCB, CMP, Singulation).
• Proven track record in leading technology development and system engineering in semiconductor capital equipment or as a user of advanced packaging equipment.
• Strong leadership capabilities, with a history of building and managing high-performing R&D teams regionally or globally.
• Deep understanding of semiconductor manufacturing and advanced packaging technologies, with a commitment to innovation and technical excellence.

What's on Offer

• Attractive remuneration package.
• Autonomy to drive innovation and development.
• Partnering with industry leaders.

Contact

Eugenia NG (Lic No: R1108105 / EA no:18S9099) Quote job ref: JN-032025-6704203